Integration of a Reliability Model Within a Virtual Analysis System For Printed Circuit Boards

Published in ASME International Mechanical Engineering Congress and Exposition', 2013

Recommended citation: Goerdt, B., Ozbolat, I., Dababneh, A., Weintraub, B., et al. (2013, 15-21 November). Integration of a Reliability Model Within a Virtual Analysis System For Printed Circuit Boards. Paper presented at the ASME International Mechanical Engineering Congress and Exposition, San Diego, California USA https://iowaguy.github.io/files/PREVIEW-publication.pdf

Virtually measuring reliability properties of printed circuit boards.

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